3 July 2018 / Madrid, Spain

Agenda

The event agenda's time zone is CEST.

Tue
3 Jul 2018
09:30 – 10:00
Registration, Welcome & MATERPLAT Spanish Platform, M. A. Rodiel, ES
Conference
10:00 – 11:00
Plenary Session

10.00-11.00 Plenary Session: 

  • 10.00-10.45 Olga Río, DG RTD, European Comission
  • 10.45-11.00 Lucía Iñigo, Spanish Delegate NMBP, CDTI

11.00-11.30 Coffee break

11.30-12.30 Thematic Presentations:

  • European Materials Platform (EUMAT), W. Keiper, BOSCH, DE 
  • Nanomaterials and EPPN, P. Queipo, PRODINTEC, ES 
  • Challenges in Chemical Materials, A. C. Devic, SUSCHEM, BE 
  • European Materials Modelling Council, A. Igartua, IK4-TEKNIKER, ES
Conference
12:30 – 13:30
Pitch - project ideas presentations (select if you want to apply for a pitch)
  • 12:30 - 12:36     Additive Manufacturing of 3D Electronics and Mechatronic Parts (AM3DEM), W. Keiper, BOSCH, DE
  • 12:36 - 12:42     Computational Multi-scale Design of Fiber Reinforced Plastics, W. Keiper, BOSCH, DE
  • 12:42 - 12:48     Data-driven virtual microstructure design for fuel cell materials, W. Keiper, BOSCH, DE
  • 12:48 - 12:54     Ultra long-life Na-ion batteries for grid-level energy storage, V. Etacheri, IMDEA MATERIALS, ES
  • 12:54 - 13:00     Novel non-destructive inspection solution for stress measurement, R. Santos, INNERSPEC, ES
  • 13:00 - 13:06     A Platform Technology for Fabrication of Nanostructures, P. Mokarian, AMBER - Trinity College Dublin, IRL
  • 13:06 - 13:12     Computational discovery of new materials for batteries, S. Estravis, ICAMCYL, ES
  • 13:12 - 13:18     Real‐time nano‐characterisation technologies, R. Llorens, AIMPLAS, ES
  • 13:18 - 13:24     Computational materials simulation & modelling, N. Vinha, ICAMCYL, ES
  • 13:24 - 13:30     Advanced materials for additive manufacturing, R. Guzmán, FIDAMC, ES

13:30 – 14:30
Lunch break
Brokerage event
14:30 – 18:00
Brokerage event
17:00 – 18:00
Visit to the facilities of the IMDEA Materials Institute

 Visits will be organized in parallel to the second B2B session.